- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
Patent holdings for IPC class H01L 23/488
Total number of patents in this class: 932
10-year publication summary
|
62
|
56
|
76
|
92
|
69
|
83
|
73
|
67
|
51
|
26
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
77 |
| Intel Corporation | 45621 |
51 |
| Huawei Technologies Co., Ltd. | 100781 |
45 |
| Changxin Memory Technologies, Inc. | 4732 |
24 |
| International Business Machines Corporation | 60644 |
20 |
| Boe Technology Group Co., Ltd. | 35384 |
18 |
| Samsung Electronics Co., Ltd. | 131630 |
17 |
| Texas Instruments Incorporated | 19376 |
15 |
| Siemens AG | 24990 |
13 |
| Rohm Co., Ltd. | 5843 |
13 |
| STATS ChipPAC Pte. Lte. | 1516 |
13 |
| Mitsubishi Electric Corporation | 43934 |
11 |
| Micron Technology, Inc. | 24960 |
10 |
| Infineon Technologies AG | 8189 |
9 |
| ATI Technologies ULC | 1396 |
9 |
| China Wafer Level CSP Co., Ltd. | 66 |
9 |
| Shinko Electric Industries Co., Ltd. | 1186 |
8 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
8 |
| Murata Manufacturing Co., Ltd. | 22355 |
7 |
| Semiconductor Components Industries, L.L.C. | 5345 |
7 |
| Other owners | 548 |